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PSP1025530_002

RF Package by Nuvotronics, Inc.
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Cubic Nuvotronics presents a new state-of-the-art Low Loss MMIC package for ALP302 LNA from Northrop Grumman. The PolyStrata® package complements integrated MMIC performance, with less than 0.18 dB insertion loss in the input path and 20 dB return loss from 16 GHz to 21 GHz. The package can be surface mounted to a PCB using standard SMT processes. This increases the ease of manufacturing while maintaining superior performance in a smaller size compared to other packaging substrates.

Product Specifications

Product Details

  • Part Number
    PSP1025530_002
  • Manufacturer
    Nuvotronics, Inc.
  • Description
    Low Loss MMIC Package

General Parameters

  • Applications
    Military, Space, Communications, Instrumention
  • Finish
    Gold over Immersion Silver
  • Frequency
    16 to 21 GHz
  • Insertion Loss
    0.18 dB
  • Mounting
    PCB, Surface Mount
  • Package Material
    Copper
  • Package Size
    0.7 x 6.34 x 3.896 mm (T x L x W)
  • Package Thickness
    0.7 mm
  • Return Loss
    20 dB
  • Type
    PolyStrata View all
  • Note
    Operating Tempture: -55 to 125 Degree C, Impedance: 50 Ohms

Technical Documents
View details on the manufacturer's website