RF & Microwave Laminates

34 Laminates from 2 Manufacturers meet your specification.
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  • Manufacturers: Panasonic Corporation, Shengyi Technology Co, Ltd, Isola Group
  • Td : 300 to 1000 Degrees C
  • Dk (Dielectric Constant) : 3 to 4 -
  • Tg : 0 to 200 Degrees C
Description:High-Speed, Low-Loss Laminate for 5G/High-end Computing Applications
Dk (Dielectric Constant):
3.10
Df (Dissipation Factor):
0.0015
Tg:
200 Degrees C
Td:
380 Degrees C
more info
Description:Halogen-free, Very Low Loss RF/Microwave Laminate
Dk (Dielectric Constant):
3.45
Df (Dissipation Factor):
0.0032
Tg:
200 Degrees C
Td:
390 Degrees C
more info
Description:Low-Loss Laminate Material for RF & Microwave Applications
Dk (Dielectric Constant):
3.48
Df (Dissipation Factor):
0.0029
Tg:
200 Degrees C
Td:
360 Degrees C
Thickness:
1.5 mm
more info
Description:Low-Loss Laminate Materials for Aerospace & Defense Applications
Dk (Dielectric Constant):
3 / 3.38 / 3.45 / 3.48
Df (Dissipation Factor):
0.0020 to 0.0029
Tg:
200 Degrees C
Td:
360 Degrees C
Thickness:
0.51, 0.76, 1.5 mm
more info
Description:High Frequency Low Loss Laminate
Dk (Dielectric Constant):
2.98 to 3.0
Df (Dissipation Factor):
0.0031
Tg:
200 Degree C
Td:
400 Degree C
Thickness:
0.127 to 1.52 mm
more info
Description:FR-4 Process Compatible Low-loss Laminate Material
Dk (Dielectric Constant):
3.45
Df (Dissipation Factor):
0.0031
Tg:
200 Degrees C
Td:
360 Degrees C
more info
Description:Very Low Loss FR-4 Process Compatible Laminate for mm-Wave Frequencies
Dk (Dielectric Constant):
3
Df (Dissipation Factor):
0.0017
Tg:
200 Degrees C
Td:
360 Degrees C
Thickness:
0.0635 to 1.50 mm
more info
Description:Ultra Low Loss Woven Glass Laminate
Dk (Dielectric Constant):
3.0 to 3.064
Df (Dissipation Factor):
0.002
Tg:
190 Degree C
Td:
400 Degree C
Thickness:
0.127 to 1.52 mm
more info
Description:Halogen-free, Low-Dk, Low Loss Material for Mobile Applications
Dk (Dielectric Constant):
3.51
Df (Dissipation Factor):
0.0095
Tg:
162 Degrees C
Td:
387 Degrees C
Thickness:
0.05 to 1.5 mm
more info
Description:Low Loss Laminate for High Speed Digital Applications Beyond 100 Gb/s
Dk (Dielectric Constant):
3.02
Df (Dissipation Factor):
0.0021
Tg:
200 Degrees C
Td:
380 Degrees C
Thickness:
0.6 to 0.05 mm(0.002 to 0.018 In.)
more info

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