RF & Microwave Laminates

56 Laminates from 5 Manufacturers meet your specification.
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  • Tg : 0 to 200 Degrees C
  • Dk (Dielectric Constant) : 3 to 4 -
Description:Ultra Low Loss Laminate and Prepreg Operates up to 25 GHz
Dk (Dielectric Constant):
3.5
Df (Dissipation Factor):
0.0020 to 0.0028
Tg:
200 Degrees C
Td:
390 Degrees C
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Description:3.9 (Dk), 195 Degrees (Tg), RF Laminate from 10 MHz to 110 GHz
Dk (Dielectric Constant):
3.9
Df (Dissipation Factor):
0.007
Tg:
195 Degrees
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Description:Copper-Clad Laminate for RF Applications
Dk (Dielectric Constant):
3.5
Df (Dissipation Factor):
0.0032 to 0.0038
Tg:
170 to 200 Degrees C
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Description:Halogen-free, Very Low Loss RF/Microwave Laminate
Dk (Dielectric Constant):
3.45
Df (Dissipation Factor):
0.0032
Tg:
200 Degrees C
Td:
390 Degrees C
more info
Description:4 (Dk), 170 Degrees (Tg), RF Laminate Up to 10 GHz
Dk (Dielectric Constant):
4
Df (Dissipation Factor):
0.013
Tg:
170 Degrees
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Description:Low-Loss Prepeg for 5G and mmWave Applications
Dk (Dielectric Constant):
3 to 3.3
Df (Dissipation Factor):
0.0019 to 0.0022
Tg:
170 to 220 Degrees C
Td:
390 Degrees C
Thickness:
0.051 to 0.140 mm
more info
Description:Low-Loss Laminate Material for RF & Microwave Applications
Dk (Dielectric Constant):
3.48
Df (Dissipation Factor):
0.0029
Tg:
200 Degrees C
Td:
360 Degrees C
Thickness:
1.5 mm
more info
Description:Low-Loss Laminate Materials for Aerospace & Defense Applications
Dk (Dielectric Constant):
3 / 3.38 / 3.45 / 3.48
Df (Dissipation Factor):
0.0020 to 0.0029
Tg:
200 Degrees C
Td:
360 Degrees C
Thickness:
0.51, 0.76, 1.5 mm
more info
Description:FR-4 Process Compatible Low-loss Laminate Material
Dk (Dielectric Constant):
3.45
Df (Dissipation Factor):
0.0031
Tg:
200 Degrees C
Td:
360 Degrees C
more info
Description:Ultra Low Loss Woven Glass Laminate
Dk (Dielectric Constant):
3.0 to 3.064
Df (Dissipation Factor):
0.002
Tg:
190 Degree C
Td:
400 Degree C
Thickness:
0.127 to 1.52 mm
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