The SpeedWave™ 300P from Rogers Corporation is a low dielectric constant, ultra-low loss resin system prepreg. It exhibits excellent fill and flow capability around heavy copper features, a low z-axis expansion for plated through hole reliability, and is CAF resistant. The SpeedWave 300P offers a typical dielectric constant of 3.16 and a dissipation factor of 0.0021 at 10 GHz with stable performance over a broad frequency range. It offers excellent thermal reliability for demanding high layer count designs requiring multiple sequential laminations.
SpeedWave prepreg is offered in multiple spread and open weave glass style and resin content combinations to give the circuit designer a wide range of options. It can be used to bond a variety of Rogers laminates including XtremeSpeed™ RO1200™, CLTE-MW™, and RO4000® series.
The SpeedWave™ 300P is compatible with FR-4 fabrication processes, UL-94 V-0 rated and compatible with lead-free processing. It is available in a panel size that measures 610 x 457 mm and is suitable for 5G mmWave, high resolution 77 GHz automotive radars, aerospace & defence, IP infrastructure (backplane, line card), optical transceiver, high-performance computing and automated test equipment (ATE) applications.