Silicon Labs Introduces New Wireless SoC Platform that is Purpose-Built for IoT

Silicon Labs Introduces New Wireless SoC Platform that is Purpose-Built for IoT

Silicon Labs has introduced its Series 3 wireless platform, which is purpose-built for the IoT, representing the next generation of IoT wireless product development. This is the first embedded computing platform with the security, performance, power efficiency, and low cost required to tap into emerging IoT market opportunities. Silicon Labs’ Series 3 22nm wireless platform will be the only multi-radio solution architected with a common code base and memory options for future-proofing and backward compatibility with Series 2. This flexibility and these features make this the most scalable wireless platform available, resulting in more efficient development and application portability.

Series 3 Wireless Platform Features:

  • Extensible: Extend your design flexibility across wireless platforms, protocols, and applications while scaling for new and expanding use cases. High performance and low power create high-volume opportunities for connected devices.
  • High-Performance: More than 100x the processing capability, including an integrated AI/ ML accelerator for edge devices, enabling the consolidation of system processing into wireless SoC. Eliminate MCUs that take up space and add cost to your system.
  • Scalable: The only multi-radio platform architected with a common code base across 30+ Silicon Labs devices. Flexible manufacturing mitigates supply risks and includes memory options that future-proof designs.

Series 3 Wireless Platform Products

SiXG302: Designed for Battery-Powered Efficiency

Expanding Series 3 to battery-powered applications, the upcoming SiMG302 and SiBG302 will deliver groundbreaking energy efficiency without sacrificing performance. Featuring Silicon Labs’ advanced power architecture, the SiXG302 is designed to use only 15 µA/MHz active current, 30% lower than competitive devices in its class. This makes it ideal for battery-powered wireless sensors and actuators for both Matter and Bluetooth applications. The SiMG302 and SiBG302 are planned for customer sampling in 2026.

Click here to learn more about the Series 3 Wireless Platform from Silicon Labs.

Publisher: everything RF
Tags:-   BluetoothSoCZigBeeIoTThread