Mini Circuits has expanded its (Monolithic Microwave Integrated Circuit) MMIC gain block amplifier portfolio with new models packaged in 1.5 × 1.5 mm QFN-style surface-mount packages. The new devices support Mini-Circuits’ broader SWaP-C (size, weight, power, and cost) optimization strategy for broadband RF signal chains.
The gain blocks are fabricated using InGaP HBT technology and operate from DC to approximately 7 GHz. They are internally matched to 50 Ω, simplifying integration into broadband and multi-band receiver architectures. Typical supply current is in the mid-30 mA range, making the devices suitable for power-constrained systems.
Housed in six-lead QFN packages, the amplifiers minimize PCB footprint while maintaining electrical and thermal performance needed for dense RF layouts. Internal matching and straightforward biasing requirements reduce external component count, supporting compact and modular RF designs.
Intended applications include satellite communications, microwave backhaul, radar receivers, and other RF platforms requiring high dynamic range amplification in space-constrained environments. The frequency coverage and linearity characteristics address the needs of sensitive receiver stages across commercial, industrial, and aerospace systems.
These new gain blocks build on Mini-Circuits’ earlier introduction of 1.5 × 1.5 mm QFN packaging across other MMIC product families, extending ultra-compact packaging to general-purpose RF amplification without changes to standard surface-mount assembly processes.
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