Smiths Interconnect, a Molex company, will participate in IMS2026, where it will present a range of advanced RF and microwave technologies designed to meet the evolving demands of high-performance applications. Visitors can explore these innovations firsthand at booth #17070, where live demonstrations will highlight the company’s latest connectivity solutions.
The showcase will feature several key technologies aimed at improving performance, reliability and efficiency in challenging environments. Among them are ceramic RF filters engineered to deliver compact, lightweight and dependable performance for radar and communications systems, with capabilities extending up to 6 GHz.
Another highlight is the K2TVA Thermopad® temperature variable attenuator. This passive solution is designed to compensate for gain variations across temperature ranges, offering a proven track record of reliability in critical systems.
Smiths Interconnect will also introduce its EZiCoax spring-loaded SMP connector, a single-piece design capable of operating up to 40 GHz. This connector aims to simplify integration while maintaining high-frequency performance.
In addition, the company will demonstrate its LightABLE-RF™ and SpaceABLE-RF™ RF-over-Fiber (RFoF) technologies. These solutions utilize 850 nm VCSEL technology over multimode fiber, enabling reductions in size, weight, power and cost (SWaP-C), while supporting next-generation system requirements.
Beyond these featured products, attendees will have the opportunity to explore Smiths Interconnect’s broader portfolio, including attenuators, terminations, power dividers, filters, circulators and isolators, as well as optical transceivers, subsystems, cables and connectors.
