MACOM, a leading semiconductor company, has announced a chip-scale hot via process built on its AlGaAs diode technology. As an alternative to traditional chip and wire bonding and copper pillar-based surface mount technologies, MACOM’s hot via process is designed to simplify surface mount assembly and provides low insertion loss and high isolation.
Hot via technology enables direct surface mount attachment by routing RF signal and ground paths vertically through the die. By removing bond wires, customers can reduce assembly complexity, improve manufacturing consistency, and minimize parasitics, contributing to signal integrity and performance in millimeter wave (mmWave) frequencies.
“MACOM continues to build on its deep expertise in microwave technologies to address our customers’ evolving performance and integration challenges. Our new hot via-based AlGaAs process can reduce assembly complexity while improving the high-frequency performance of our integrated components,” said Stephen G. Daly, President and Chief Executive Officer, MACOM.
Intended for applications including switches, limiters, and other control functions, the new process will be deployed on MACOM’s existing AlGaAs diode technology.
MACOM’s first product using the AlGaAs hot via process technology is the MASW-011261, a broadband SPDT switch operating from 60 to 110 GHz. It provides a typical insertion loss of 0.9 dB, an isolation of 30 dB, and sub-20 ns switching speeds, all in a 1.87 x 1.98 mm chip-scale package.
The MASW-011261 and MACOM’s hot via process are on display at MACOM’s Booth #17035 at the International Microwave Symposium (IMS 2026) in Boston, MA, this week.
Click here to learn more about MASW-011261.
