Analog Devices has introduced ADMV1355, a microwave upconverter designed for wideband radio systems operating across an RF output frequency range of 17.7 GHz to 55 GHz. The device integrates multiple RF and local oscillator (LO) functions into a single component.
The upconverter incorporates an integrated RF signal chain with tunable sideband rejection filters and gain control digital step attenuators (DSAs). Following frequency conversion, the design includes two switch-selectable RF output driver chains. One chain supports operation from 17.7 GHz to 34 GHz, while the other covers 30 GHz to 55 GHz. Each chain includes multiple stages of signal level control and harmonic filtering.
The integrated LO signal chain accepts input frequencies from 8.85 GHz to 27.5 GHz. It includes internal amplification, a 2× frequency multiplier, a tunable harmonic rejection filter, and phase adjustment circuitry. These elements generate the required LO signal to drive the in-phase/quadrature (I/Q) mixer.
Block Diagram of the ADMV1355
The device supports three frequency translation modes, allowing different input configurations. In IF hybrid mode, a single intermediate frequency input in the 8 GHz to 12 GHz range is processed through an on-chip 90° hybrid to generate quadrature signals. In complex IF mode, two quadrature IF signals from 1 GHz to 12 GHz are used. In baseband mode, differential I/Q signals from DC to 12 GHz are accepted.
Programmability is provided through a serial peripheral interface (SPI), which supports both 3-wire and 4-wire configurations. The interface enables adjustment of functions such as gain control, sideband rejection, LO carrier feedthrough calibration, and tunable filters. The device also includes general-purpose logic outputs and lookup table (LUT) inputs for integration into systems requiring fast frequency hopping.
All RF output, LO input, and IF input pins are single-ended and matched to 50 ohms, while the differential baseband I/Q inputs are matched to 100 ohms. No external matching circuitry is required.
The device is packaged in a 120-ball CSP BGA form factor measuring 6 mm × 6.5 mm. It operates over a temperature range of −40°C to +95°C and supports heat dissipation through either the top of the package or the printed circuit board.
Target applications include satellite payloads and ground stations, wideband radar and electronic warfare systems, instrumentation and automatic test equipment, and millimeter-wave 5G and 6G test platforms.
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