Amphenol RF has released their first set of ANSYS HFSS 3D component models. These 3D models are available free of cost from Amphenol RF and are compatible with ANSYS R17, or any newer version of the software.
The introduction of the 3D model allows the customer to test a variety of PCB connectors within their design without the need for a physical prototype. These 3D component models are intended to shorten the testing process and give designers and engineers the opportunity to optimize the return loss performance of their board launch.
ANSYS 3D component models are currently available for Amphenol RF’s line of SMA High Frequency End Launch Connectors. Additional 3D models are currently in production and will be released soon.