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BFM06010 Image

The BFM06010 from Sivers Semiconductors is an IEEE 802.11ad mmWave Beamforming RF Module that operates from 57 to 71 GHz. It has a 16+16 Tx/Rx channel array with support for ±45° beam steering and throughput of 7 Gbps. This beamforming module has integrated SiversIMA high-performance TRX BF/01 mm-wave beamforming transceiver IC, antenna arrays, loop filter, LDO, and baseband functionality. The architecture of this module uses direct conversion in both transmit and receive mode, with a signal path optimized for the onboard 60 GHz patch antenna and seamless IQ connection with the baseband modem. It includes analog channel filtering for suppression out of band interferers, making the RF Module robust in a noisy radio environment. The module also includes a fully autonomous AGC, optimizing the receive gain based on both wanted as well as out of band signal levels.

The BFM06010 supports MCS0-12, 128QAM (full channel) and 256QAM (half channel) modulation schemes. It supports half and quarter band channels and also includes support for 2 GHz channels. This beamforming module is easy to use with autonomous calibration routines and a seamless baseband interface. It is available in an eWLB package and is ideal for use in data and telecommunication infrastructure solutions such as fixed wireless access, residential broadband access, fronthaul, small cell backhaul, macrocell backhaul, and wireless high-speed point to multipoint networks, meshed networks, wireless access points, etc.

Product Specifications

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Product Details

  • Part Number
  • Manufacturer
    Sivers Semiconductors
  • Description
    16+16 Tx/Rx Array mmWave Beamforming Module from 57 to 71 GHz

General Parameters

  • Application
    5G, Telecommunication, Fronthaul, Small / Macro cell backhaul
  • Type
  • No of Channels
    16 Channels
  • Band
    V Band
  • Frequency
    57 to 71 GHz
  • Note
    Throughput: 7 Gbit/s, IF bandwidth: 1.2 GHz

Tx Parameters

  • Tx Power
    40 dBm

Rx Parameters

  • Rx Noise Figure
    7 dB


  • Package Type
    Surface Mount
  • Package
    Embedded Wafer Level Ball Grid Array

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