Movandi Develops 300+ Antenna Array Using TSMC Bulk CMOS Technology for 5G Infrastructure Applications

Movandi Develops 300+ Antenna Array Using TSMC Bulk CMOS Technology for 5G Infrastructure Applications

Movandi, a leader in 5G mmWave RF technologies and products, announced that its 300+ antenna PAAM (Phased Array Antenna Module) design using TSMC CMOS technology delivers breakthrough performance with the scale and cost-efficiency of bulk CMOS. Movandi’s phased array solution delivers the ideal combination of output power, cost, antenna count and energy efficiency for mmWave infrastructure applications.

The PAAM utilizes Movandi’s expertise in antenna and RF design and incorporates Movandi’s production-shipping beamformer, up/down converter and synthesizer chips. Deep application RAMs on all Movandi chipsets allow programmable schedules and a large beam-book, for dynamic control and fast beam steering. A symbol-level PAAM controller enables accurate TDD, AGC, beamforming as well as power saving modes that include symbol-level power save and tapering.

The Movandi PAAM was developed to support a custom ORAN-RU product and is capable of >59dBm EIRP per beam and is configurable in several modes of operation including 2T2R, 4T4R and 8T8R. The PAAM achieves this EIRP while maintaining better than 4% EVM.

Maryam Rofougaran, CEO and co-founder of Movandi, said that Movandi has demonstrated its chip design excellence by delivering the highest performing PAAM for mmWave infrastructure. TSMC’s industry-leading CMOS technology allows them to fulfill their customers’ requirements at scale and the most efficient price point. Their mmWave and CMOS core technology leadership is unmatched in the industry and this leap forward is just what is required in mmWave infrastructure applications.

CMOS technology provides industry-leading cost, EIRP and DC efficiency when compared to other options. This provides an attractive solution that blends a low-price point, moderate output power per port, optimal antenna count and excellent thermal density into an overall solution for end-product design.

Movandi’s PAAM design was developed and manufactured with the bulk CMOS technology of TSMC, the world’s leading semiconductor foundry. “TSMC has long partnered with industry innovators to extend CMOS applications from automotive to IoT and wireless,” said Sajiv Dalal, Senior Vice President of Business Management, TSMC North America. “We look forward to our continued collaboration with Movandi to help them achieve power and performance goals and accelerate their next-generation silicon innovations using our industry-leading CMOS technology.”

Related to this story, Anders Storm, CEO of Sivers Semiconductor, published on Twitter that MixComm, another company in this space has developed a 96 Element PAAM on RFSOI Technology using Globalfoundfries. MixComm was acquired by Sivers Semiconductor earlier this month. Click here to read more about MixComm and Sivers Semiconductor.


Publisher: everything RF