ATIS’ Next G Alliance (NGA) has released the 6G Component Technologies White Papers Series, a collection of four white papers addressing critical technologies that will support North American leadership in the development of 6G. The series covers Antenna, Packaging, and Testing – Examines emerging technologies and challenges in antenna design, packaging, and testing for 6G wireless communication systems.
Circuits and Subsystems – Covers RF circuit and subsystem challenges essential for enabling large-scale, efficient 6G services. It outlines a baseline transceiver architecture and discusses carrier frequency, Local Oscillator (LO) frequency generation, link budgets, High Order Modulation (HOM), beamforming, Integrated Sensing and Communication (ISAC), Non-Terrestrial Networks (NTN), and AI/EDA tools.
Next G Displays – Identifies hardware and video content challenges for immersive 6G displays, presenting potential solutions and future development directions in software, content innovation, and augmented reality. Key recommendations are included.
Semiconductor Technology – Analyzes the need for further semiconductor development to support complex 6G transceivers across multiple frequency bands. It breaks down the main building blocks of transceivers and highlights areas requiring further technological advancement.
“The Component Technologies White Papers Series is a critical contribution toward defining the key technologies comprising the National 6G Roadmap’s technology layer,” said Next G Alliance Managing Director Jaydee Griffith. “Each component covered will be a key building block for North American leadership in the 6G future.”
