Teledyne Technologies Incorporated brings together a wide range of RF and microwave products and capabilities, including high-performance semiconductors, components, modules and interconnects, signal and power switching, and thermal imaging, at the International Microwave Symposium, June 9-11, in Boston. Visitors to Booth 19076 can see how Teledyne's integrated portfolio addresses the full signal chain across communications, radar, and electronic warfare.
Live Demonstrations at IMS 2026
TSA-220060 3U VPX Multichannel Converter: The TSA-220060 is a rugged, open systems-compliant 3U VPX multi-channel converter that integrates two wideband transceivers on a single compact card. Covering 0.5 to 20 GHz with 2 GHz instantaneous bandwidth, the module delivers high dynamic range, excellent phase noise, and built-in LO generation for demanding RF and microwave applications.
Non-Uniform Sampling (NUS) via the EV10AS940 12.8 GSps ADC: The EV10AS940 is a high-performance ADC designed to enable direct signal conversion up to Ka-Band for ground-based and space-based systems, including SATCOM payloads and SAR imaging applications. With an ultra-wide 33 GHz input bandwidth, it supports multi-band operation from L-Band to Ka-Band and integrates multiple DDC channels with I/Q decimation, multi-NCOs, fast frequency hopping, beamforming features, and multi-ADC synchronization. Operating at 12.8 GSPS with only 2.5 W power consumption, the EV10AS940 supports the shift toward digital beamforming in phased array systems by delivering strong RF performance with low power. Available in space and military versions, it also enables in-orbit payload reconfiguration across multiple frequency bands.
High-Performance Cables, Connectors, and Board-Mount Interconnects: The WavePulser 40iX High-speed Interconnect Analyzer combines Vector Network Analyzer (VNA) and Time Domain Reflectometer (TDR) capabilities in a single instrument, providing detailed characterization of high-speed interconnects in both the frequency and time domains from one acquisition. It can measure S-parameters like a VNA and impedance profiles like a TDR, while also supporting advanced de-embedding to the IEEE 370-2020 standard, along with emulation and simulation of high-speed serial data channels. With no calibration required and a cost that is significantly lower than a traditional VNA, the WavePulser 40iX offers a practical solution for engineers working on high-speed digital design, signal integrity, and interconnect validation.
Vector Network Analyzer (VNA) + Time Domain Reflectometer (TDR) Capabilities
Real-Time Thermal Imaging: Full-field temperature mapping for rapid identification of overheating components, electrical shorts, and thermal stress points.
Additional Products on Display
The booth also features Teledyne's broader portfolio of RF and microwave technologies, including space and defense components, precision switching and interconnect solutions, rapid prototyping, and advanced sensing technologies.
“What sets Teledyne apart is our ability to solve complex customer challenges across the full RF chain,” said Mark Kotilinek, President of Teledyne Defense Electronics. “Built on decades of expertise, our extensive portfolio, from component-level offerings to complete systems like our Phobos and Deimos ESM solutions, continues to evolve to deliver the performance required for mission-critical applications.”
Teledyne technical experts are available throughout IMS 2026 to discuss the live demonstrations, system requirements, emerging RF architectures, and application-specific solutions across communications, electronic warfare, and radar systems.
