StratEdge Corporation, a leader in the design and production of high-frequency, high-power, and high-reliability packages, offers gold plated tabs for advanced semiconductors that require superior thermal and electrical performance.
StratEdge’s gold plated tabs are designed to support eutectic die attach for gallium nitride (GaN) and other high-power devices using gold-tin (AuSn) and gold-silicon (AuSi) solders. The tabs provide a practical die-on-tab solution for applications where direct eutectic attach to an organic board is not suitable due to temperature limitations.
For chip-on-board applications, the semiconductor chip is attached to the thermally conductive tab before the tab is installed onto the board. This approach helps protect temperature-sensitive board materials while supporting the performance requirements of high-frequency and high-power devices. Designers of phased arrays may want to use the board to combine multiple antenna elements when space is often limited.
“Gold plated tabs give engineers a reliable path for integrating advanced devices into demanding RF, microwave, and power applications,” said Casey Krawiec, vice president of Global Sales at StratEdge. “For high-power density semiconductors, having a reliable first-level interface is extremely important. Our tabs help our customers achieve this.”
Additional information about StratEdge’s packaging and assembly capabilities is available in the company’s white paper, Die-on-Tab for Compound Semiconductors: Enabling Advanced RF Power Systems.
