SX-SDMAX

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SX-SDMAX Image

The SX-SDMAX from Silex Technology is a Dual-band 2.4/5 GHz Wi-Fi 6 and Bluetooth v5.3 Combo Module. It delivers a PHY data rate of up to 600 Mbps (at 5GHz/80MHz/MSC11) in Wi-Fi mode. This module is based on NXP’s highly integrated IW611 chipset and supports MU-MIMO and OFDMA that improves stability in dense networks and delivers data reliably with low latency even in congested radio wave environments. It requires a DC supply of 1.8/3.3 V, and consumes less than 260 mA of current in Tx mode and 150 mA of current in Rx mode. This module implements Target Wake Time which increases the sleep time of the module and improves battery life. It supports IEEE 802.11a/b/g/n/ac/ax Wi-Fi standards.

The SX-SDMAX supports up to 1024 QAM modulation schemes and includes a multiple BSS feature. It incorporates a mechanism for avoiding collisions between packets and for efficiently avoiding radio wave interference for efficient communication. This module can be controlled via SDIO 3.0 (Wi-Fi) and UART (Bluetooth) interfaces. It is available in a 44-pin LGA package that measures 17.00 x 18.00 x 2.65 mm with an MHF connector for the antenna and is ideal for battery-operated medical devices, mobile printers, handheld POS and terminals, barcode scanners, and IoT applications.

Product Specifications

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Product Details

  • Part Number
    SX-SDMAX
  • Manufacturer
    Silex Technology
  • Description
    2.4/5 GHz 600 Mbps Wi-Fi 6 and Bluetooth 5.3 Combo Module

General Parameters

  • Technology
    WiFi + Bluetooth
  • Application
    Battery operated medical devices, mobile printers, Hand held POS and terminals, barcode scanners, IoT Applications
  • Bluetooth Standards
    Bluetooth v5.3
  • WiFi Standards
    802.11 ax/ac/a/b/g/n
  • Standard Supported
    BR + EDR + BLE
  • Data Rate
    Up to 600 Mbps
  • Supply Voltage
    1.8 / 3.3 V
  • Current Receiving
    10 to 150 mA
  • Current Transmitting
    20 to 200 mA
  • Interface Type
    SDIO, UART
  • Chip
    NXP IW611
  • Package
    44-pins Land Grid Array (Direct Solder)
  • Weight
    1.7 g
  • Mounting Type
    Surface Mount
  • Dimension
    17.0 × 18.0 × 2.65 mm
  • Operating Temperature
    -40 to 85 Degree C
  • RoHs
    Yes

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