RF Module by SparkLAN (74 more products)

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AP5881 Image

The AP5881 from SparkLAN is a 2.4/5/6 GHz Tri-Band Wi-Fi 6/6E + Bluetooth 5.2 SiP Module. It delivers a PHY data rate of up to 600 Mbps (Wi-Fi) and up to 4 Mbps (Bluetooth). This module is based on a Synaptics chipset and supports 20, 40, and 80 MHz channels with optional SGI for 5/6 GHz bands. It supports DSSS (DBPSK, DQPSK, CCK), OFDM & OFDMA (BPSK, QPSK, 16-QAM, 64-QAM, 256-QAM, and 1024-QAM), GFSK, π/4-DQPSK, and 8-DPSK modulation schemes. The module operates as a Bluetooth Class 1/2 transmitter and supports extended synchronous connections (eSCO) for enhanced voice quality by allowing for the retransmission of dropped packets. It also supports Adaptive frequency hopping (AFH) for reducing radio frequency interference.

The AP5881 supports 802.11ax/ac/a/b/g/n standards and operates in 2.4 GHz (Bluetooth/Wi-Fi), 5/6 GHz for Wi-Fi bands including 5, 6, 7, and 8 UNII bands. It provides a Tx power of 17 dBm and has an Rx sensitivity of up to -90 dBm. This module requires a DC supply of 3.3 V and consumes less than 90 mA of current. The module is available in a stamp-type SiP package that measures 8.5 x 8.5 x 1.0 mm and can be controlled via PCIe 3.0 Gen 2, SDIO V3.0/2.0 & USB 2.0 (for Wi-Fi) and HCI UART, PCM & I2S (for Bluetooth) interfaces. It is ideal for tablets, OTT boxes, and portable & mobile device applications.

Product Specifications

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Product Details

  • Part Number
  • Manufacturer
  • Description
    2.4/5/6 GHz, 600 Mbps Wi-Fi 6/6E + Bluetooth 5.2 Tri-Band SiP Module

General Parameters

  • Technology
    WiFi + Bluetooth
  • Frequency
    2400 to 7115 MHz
  • Bluetooth Standards
    Bluetooth v2.1 + EDR, Bluetooth v3.0, Bluetooth v4.0, Bluetooth v4.1, Bluetooth v4.2, Bluetooth v5, Bluetooth v5.2
  • WiFi Standards
    802.11 ax/ac/a/b/g/n
  • Data Rate
    Up to 54 Mbps
  • Modulation
  • Supply Voltage
    3 to 5.25 V
  • Output Power
    13 to 17 dBm
  • Integrated Antenna
  • Interface Type
    USB 2.0, PCIe, SDIO, 12C, PCM, UART
  • Processor
    Linux, Android
  • Chip
  • Weight
  • Mounting Type
    Surface Mount
  • Dimension
    8.5 x 8.5 (typical) mm x 1.0mm(Max.)
  • Operating Temperature
    -30 to 85 Degree C
  • Storage Temperature
    -40 to 125 Degree C
  • RoHs