The TS3000-DS from MPI Corporation is a Double-Sided Automated Wafer Probe System designed for testing silicon photonics (SiPh) and electro-optical devices. It provides true double-sided probing by enabling electrical contact from the top side of the wafer while aligning optical fiber arrays from the opposite side, supporting advanced wafer technologies such as COUPE. The system combines a Hexapod and NanoPositioner-based optical setup for high-precision grating and edge-coupling alignment with an electrical setup that supports 4.5-inch probe cards, DC probes, and RF micro-positioners. It provides optical alignment repeatability of 0.1 dB, a resolution of 0.5 µm, and a positioning accuracy of less than 2.0 µm.
The TS3000-DS system integrates a Z-distance sensor for precise optical probe positioning and offers active vibration isolation for improved measurement stability. The system is controlled using MPI's SENTIO software suite, which provides an intuitive multi-touch interface for probe station operation and test automation. It can also be interfaced with QAlibria® RF Calibration Software for simplified and accurate RF calibration, as well as NIST StatistiCal packages for advanced calibration and uncertainty analysis. This probe system requires a 100-240 V AC supply and consumes less than 500 VA of power. It measures 1830 x 1385 x 1760 mm and is ideal for silicon photonics, electro-optical device characterization, and advanced wafer-level testing applications.
