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ISP2554-HM Image

The ISP2554-HM Series from Insight SiP are Multi-Protocol Bluetooth Low Energy (BLE) 6.0 Modules. They support a wide range of protocols such as Bluetooth Mesh, Thread, Matter, LE audio, Auracast, Bluetooth direction finding, channel sounding, ANT+, and proprietary 4 Mbps to support different connectivity requirements. These wireless modules are based on Nordic’s nRF54H20 chip and consists of 2 ARM Cortex-M33 processors, 2 RISC-V co-processors, a 2 MB NVM, 768 KB RAM, an antenna, and built-in security. They can replace multiple processors, thereby reducing the bill of materials (BOM) and dimensions of complex IoT nodes. 

The ISP2554 Series’ security block comply with the PSA Level 3 security standard and integrates secure boot and storage, anti-tamper, PUF, and crypto accelerators to prevent cyber attacks and damage. These BLE modules can be controlled via CAN bus, high-speed USB, and QDEC interfaces. They deliver an output power of +10 dBm and has a receive sensitivity of -100 dBm. These BLE chips are available in land grid array (LGA) packages that measure 9 x 9 x 1 mm. They are ideal for smart home, advanced wearables, LE audio, remote and gaming controllers, e-mobility, and AR/VR applications.

Product Specifications

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Product Details

  • Part Number
    ISP2554-HM
  • Manufacturer
    Insight SiP
  • Description
    Multi-Protocol Bluetooth Low Energy 6.0 Modules

General Parameters

  • Technology
    Thread, Bluetooth
  • Application
    Smart Home & Matter, Industrial IoT, Sensor Fusion, Wellness & Medical Devices, Advanced Wearables, Remote & Gaming Controllers, Virtual & Augmented Reality, E-mobility, LE Audio
  • Bluetooth Standards
    Bluetooth v6 View all
  • Mesh Networking
  • Data Rate
    Up to 4 Mbps
  • Sensitivity
    -100 dBm
  • Output Power
    Up to 10 dBm
  • Supply Voltage
    1.7 to 3.6 V
  • Integrated Antenna
  • Interface Type
    SPI, UART, 12C
  • Memory
    NVM 2 MB / RAM 768 KB
  • Processor
    Arm Cortex-M33 Radio Processor 256 MHz
  • Chip
    nRF54H20 Nordic Chip (22nm process node)
  • Package
    LGA
  • Mounting Type
    Surface Mount
  • Dimension
    9.0 x 9.0 x 1.0 mm
  • Operating Temperature
    -40 to 105 Degree C
  • RoHs
    Yes

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