At IMS 2026 in Boston, Cinch Connectivity Solutions highlighted its latest RF innovations at its booth, where Ketan Thakur, Johnson Product Manager, presented a range of new additions to the Johnson RF connectivity portfolio. The showcase at booth #15030 focused on cable assemblies, angled connectors, and compact interconnect solutions designed to support high-frequency RF and microwave applications.
Ketan walked us through the company’s newest product introductions, starting with its 2.4 mm and 2.92 mm cable assemblies. These assemblies are configured as between-series solutions, combining 2.4 mm or 2.92 mm interfaces on one end with SMP or SMPM on the other. Designed for high-frequency performance, the assemblies support frequencies up to 50 GHz while maintaining low insertion loss. They are offered in standard fixed lengths ranging from 6 inches to 60 inches (100 mm to 1 meter), making them suitable for a range of test and measurement and system integration use cases.
Ketan also introduced Cinch Connectivity’s expanded angled connector portfolio, developed to address mechanical and layout constraints in RF designs. The lineup includes 30-degree and 45-degree angled connectors, with interface options ranging from SMA to 1.85 mm, supporting frequencies up to 67 GHz. These connectors are designed to improve performance in space-constrained environments, such as board edges or areas with height limitations. By reducing cable bending and stress, they also help preserve signal integrity and extend cable assembly life in demanding applications.
Another key product highlighted in the presentation is the company’s narrow-profile solderless end-launch connector. This solution is engineered for compact, high-performance PCB integration. Available across SMA to 1.85 mm interfaces, the connector supports frequencies up to 67 GHz and accommodates multiple PCB thicknesses. Its compact footprint, approximately 0.3 inches by 0.3 inches, makes it about 40% smaller than previous solderless designs, enabling higher density layouts without compromising performance. The solderless design also simplifies installation and reduces assembly time.
The products presented by Cinch Connectivity Solutions at IMS 2026 reflect a continued focus on enabling higher frequency performance, improved mechanical flexibility, and compact integration for next-generation RF and microwave systems.
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