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MGM210P

RF Module by Silicon Labs (38 more products)

Note : Your request will be directed to Silicon Labs.

The MGM210P is a pre-certified module that supports Zigbee, Thread, Bluetooth 5.1, Bluetooth Mesh or multi-protocol (Zigbee + Bluetooth 5.1) connectivity and networking capabilities. This multiprotocol module has an optimized form-factor with an integrated chip antenna and low profile for space-constrained IoT designs including smart lighting, HVAC, building, and factory automation systems.

Built around the EFR32MG21 Wireless Gecko Series 2 SoC, this module has a powerful Arm® Cortex®-M33 processor, best-in-class software stacks, a dedicated security core and a +125 oC temperature rating suited for harsh environmental conditions. Pre-certified for North America, Europe, Korea and Japan, it has an integrated RF power amplifier that makes the module ideal for long-range Bluetooth Low Energy applications requiring hundreds of meters of line-of-sight connectivity. The module measures 12.9 x 15 x 2.2 mm and is ideal for smart home, commercial and industrial applications.

Product Specifications

    Product Details

    • Part Number :
      MGM210P
    • Manufacturer :
      Silicon Labs
    • Description :
      Pre-Certified Zigbee, Thread and Bluetooth Mesh Module

    General Parameters

    • Technology :
      Bluetooth + ZigBee, Thread
    • Application :
      IoT, Connected lighting, Smart home, Building Automation and Security
    • Frequency :
      2.4 to 2.4835 GHz
    • Bluetooth Standards :
      Bluetooth v5.1
    • Mesh Networking :
      Yes
    • Data Rate :
      Up to 2 Mbps
    • Supply Voltage :
      1.8 to 3.8 V
    • Current Receiving :
      9.3 to 9.4 mA
    • Current Transmitting :
      16.1 to 181.3 mA
    • Sleep current :
      5.1 to 8.5 uA
    • Output Power :
      10 to 20 dBm
    • Power :
      0.01 to 0.1 W(Tx)
    • Sensitivity :
      -104.5 to -94.1 dBm
    • Integrated Antenna :
      Yes
    • Antenna :
      Chip Antenna
    • Interface Type :
      I2C, I2S, IrDA, SPI, UART, GPIO
    • Security :
      AES128/256
    • Memory :
      1024 kB(Flash), 96 Kb(Ram)
    • Processor :
      32-bit ARM Cortex®-M33 with DSP instruction and floatingpoint unit for efficient signal processing
    • Dimension :
      12.9 X 15 X 2.2 mm
    • Operating Temperature :
      -40 to 125 Degree C

    Technical Documents

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