The LBEE5HY2FY from Murata is a Wi-Fi and Bluetooth 5.4 Module that operates in the 2.4 GHz, 5 GHz, and 6 GHz bands. It is designed in a robust and small form factor that facilitates integration into size- and power-sensitive applications such as IoT, handheld wireless systems, and gateways. This module supports Wi-Fi protocols such as 802.11a/b/g/n/ac/ax. It utilizes Infineon’s CYW55513 combo chipset that implements enhanced, collaborative coexistence hardware mechanisms and algorithms to optimize WLAN and Bluetooth coexistence for maximum performance. This wireless module uses several modulation schemes - DSSS, CCK, OFDM, and OFDMA. It delivers a data rate of 143 Mbps (Wi-Fi) and 3 Mbps (Bluetooth).
The LBEE5HY2FY can be operated in uAP or STA dual-mode for flexible Wi-Fi connectivity. This combo module is equipped with a free RTOS and Cypress WICED development kit to develop IoT applications on NXP i.MX Linux platform. This module’s WLAN functionality can be controlled via the SDIO 3.0 interface, while the Bluetooth functionality can be controlled through the high-speed 4-wire UART interface. The PCM and I2S interfaces are also available to provide audio data. This combo chip is available as a module that measures 7.9 x 7.3 x 1.1 mm and has a shielding capability.
